Electronics Forum: reflow profile (Page 141 of 260)

Re: IC leg of RF unit lifted..

Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F

Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan

Re: REFLOWING WHITE TIN PLATED PADS

Electronics Forum | Wed Aug 18 11:52:35 EDT 1999 | Brian

| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.

Re: Reflow Oven Capability Study

Electronics Forum | Wed Jul 07 18:22:25 EDT 1999 | ETS - Brian Stumm

My company, ETS, is a manufacturer of solder reflow and curing ovens. I would be happy to share some of our q/c test methods with you for verifying the uniformity and repeatability of the new ovens we manufacture. I think these tests will tell you al

Re: white residue after wash

Electronics Forum | Fri Apr 03 08:22:36 EST 1998 | Scott Cook

| At this moment in time we are using water soluble solder paste on our PCBs these are cleaned using water only, agitated with ultrasonics. After drying a white/grey residue is left around solder joints. Reflow profile is fine and a reliable wash pro

B.I.C. SMT Process Controls

Electronics Forum | Thu Aug 09 12:53:59 EDT 2001 | seand

Hello everyone, First when defining any criteria for process control, one should identify quantiatively that criteria. Then one establishes an effective method for measuring such a criteria. Once you have a test method, your gateway to a solving y

Reflow Oven Selection

Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael

I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o

SMT process Blowhole/ Pinhole

Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman

we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r

BGA rework

Electronics Forum | Mon May 27 12:14:35 EDT 2002 | arcandspark

I use the exact same paste flux that we use in our solder paste for SMT manufacturing with great success. I have also had great success using the Air Vac DRS Hot Gas units with the same size BGA's. If to much heat is applied to fast to the BGA be it

RF Shields

Electronics Forum | Sun Mar 11 08:28:10 EDT 2007 | dave

Hi All, I would like to get some advice from users who place rfshields pre-reflow and reflow onto board. We ran a batch a few months back and boards which had the shields reflowed failed to function properly ~ I was happy enough that the profile

Reflow Oven Profiling

Electronics Forum | Tue Apr 25 10:13:17 EDT 2006 | slthomas

What kind of parts are on the bottom? Small passives are very unlikely (won't unless other abnormal factors come into play) to fall off when reflowed a second time regardless of temperature differential. There is a simple weight/soldered surface ar


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