Electronics Forum | Wed Feb 14 14:11:17 EST 2007 | greg york
We have profiled hundreds of ovens here and it really is dependent on work going through, I walked in on one trial and was faced with an oven that was literally two foot long and told the guy it would not be suited only to profile and run lead free t
Electronics Forum | Thu Mar 01 12:40:55 EST 2007 | james
We are using lead paste on both sides, the only reason we need to change the profile is because the BGA is lead free. I decided to run the BGA side first, then the connector side. This way I am not running both sides through on a hotter profile.
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Mon Feb 04 10:30:10 EST 2008 | tonyamenson
Well the profiler IS out for calibration so I can't use it. However, what piqued my curiosity is your statement concerning uneven heating. On the product we were running we had several non-liquidous solderjoints where as the rest of the joints looke
Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33
5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc
Electronics Forum | Mon Feb 02 09:22:55 EST 2009 | ck_the_flip
Everyone's telling you setpoints, but yet, we haven't seen a thermal profile from you. It'd help if you can provide this, and using everyone's recommended setpoints, determine if your profile is meeting: 1.)Time Above Liquidus 2.) Peak 3.) Ramp
Electronics Forum | Wed Feb 04 09:18:57 EST 2009 | stepheniii
You need to profile to the paste. And if a part can't take the temperatures, then you have to have something done about the parts. At one time most components had peak temperature information back when we didn't really need it becuase profiles were
Electronics Forum | Thu Feb 18 14:34:39 EST 2010 | jlawson
I have also seen on Heller ovens (even new ones EXL series) cross profile temperature differences over their spec of +/- 3 deg C, sometimes up to 7-10 deg C, 200-230mm from fixed rail. This can cause funny issues , profiling can cover this up and not
Electronics Forum | Thu Jun 19 10:31:28 EDT 2014 | emeto
Hi Edri, this is not a race here. Are you curing some kind of glue on your board? THe shortest profile I ever ran is for AIM solder paste - about 4 minutes total. with speed 8m/min your profile is going to be 45 seconds and I don't think this is the
Electronics Forum | Fri Aug 24 12:17:01 EDT 2018 | spoiltforchoice
To my mind, the solder paste has clearly melted, but your HASL plating has not. This with your profile seems to suggest there's something a little weird about your PCB. However, there are probably still questions we could ask - have you successfully
