Electronics Forum | Wed Oct 03 13:48:42 EDT 2001 | rocco
hello every body !! We are assembling a new product with some kind of components like (soic)but this component has a metalic surface under the package that works like pin,is a ground terminal,and in the PCB you can see a pad, among the other pads,so
Electronics Forum | Mon Mar 01 11:03:51 EST 1999 | Dennis Xiong
Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o
Electronics Forum | Mon Mar 01 11:03:22 EST 1999 | Dennis Xiong
Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o
Electronics Forum | Mon Oct 19 17:43:12 EDT 1998 | John Gregory
Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Mon May 18 17:59:06 EDT 1998 | Richard Jackson
I've tried every thing I can think of. Do you have any Ideas? What I have is micro balls on the gold fingers of panelize boards. These balls only appear on the gold finger. Or at least I can only find them on the gold fingers. What I have tried so
Electronics Forum | Tue May 26 20:24:39 EDT 1998 | Dave F
| Does anybody know a (if possible low-cost) system | which can travel with the PWBs through a reflov oven | (like some temperature profile loggers) for measuring | the residual oxygen? My problem is, it is a batch oven | which does not allow to h
Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Wed Oct 30 09:16:51 EST 2002 | russ
Low air flow huh. This is interesting, I have a low end machine that has adjustable air flow and I was having some shorting problems awhile back (corners mostly) and my first attempt was to preheat the board up to 170C and then use lower temp to put
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
