Electronics Forum | Sat Sep 27 09:32:36 EDT 2003 | mantis
All, I was wondering what causes the corners of a bga to lift during reflow process.Now just to clarify i have been running this one particular product for 4 years and i have the process and reflow profile down to a tee.But recently i have witnessed
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward
Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi
Electronics Forum | Mon Aug 11 20:50:44 EDT 2003 | davef
Our old friend Bob Willis posted at his site [ http://www.bobwillis.co.uk ] a document that may be a good starting point. In the "Download" section, look for "New Product Design Evaluation Form (Word.doc file)". Certainly the number of solder connec
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Fri Jul 04 05:40:09 EDT 2008 | proy
Thanks, I'll give this a try. Peter
Electronics Forum | Thu Oct 05 11:48:00 EDT 2006 | Mario Scalzo, SMT CPE
Good morning all. We are able to offer some insight into the problem and offer a recommended reflow profile to solve this issue, but it really depends on the solder paste that you use, as different manufacturers use different boiling point solvents.
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Thu Jun 13 12:50:00 EDT 2019 | don_julio
> A couple of caveats; The FR4 will degrade with > successive reflows and will eventually need to be > replaced. Not a big deal for low volume, but > something to be aware of. The bigger concern is > that a sheet of .125" lar
Electronics Forum | Tue May 20 06:14:32 EDT 2008 | roc2x
Hi, Im qulifiying 2 PCB supplier and supplier A has no defect found but supplier B got 4 defective cards and 4 are same failure. 4 cards having lifted pad after reflow in same BGa location. I run the 2 PCb supplier in one reflow,using same profile,sa
