Electronics Forum | Wed Mar 21 01:19:29 EST 2001 | PeteC
We're watching more carefully at post-print and pre-reflow inspections for products with the gold finger contacts. Not 100% sure the cause. SMT line people suspect primary cause is improperly wiped stencil. Do you know any other possible causes? We g
Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham
Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow
Electronics Forum | Thu Jul 20 16:40:32 EDT 2000 | armintan
Do present reflow and wave solder equipment currently processing tin-lead process need to be replaced when migrating to lead free process ? Is there any equipment (reflow or wave) out there capable of processing both leaded and unleaded processes wh
Electronics Forum | Wed Jun 13 16:13:54 EDT 2001 | Igmar
Have anyone seen this problem: Capacitors (100nF 0805) placed on PCB and then appear cracked after reflow. After reflow, the solder joints look visualy acceptable. Then capacitors fail during testing. When attempting to remove capacitor with hot sol
Electronics Forum | Thu Jun 14 00:50:32 EDT 2001 | procon
Greg, You may want to look into having a company that specializes in reflow optimization come to your facility and get you all set-up. Their are many companies that will come in and create the best profiles for your product with a process window tha
Electronics Forum | Mon Jul 30 21:07:35 EDT 2001 | davef
So, yer loosing parts between place and reflow? That would seem to say yer: * Paste has lost tackiness [check the fine SMTnet Archives for a sample test.]. * Really not placing the parts that you think yer placing. * Knocking the parts out of place
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Wed Jan 26 21:16:28 EST 2000 | Dave F
Mark: It sound like one or more of the following is happening: * Previous heat cycles (ie, reflow, reflow, wave) are degrading the surface protectant * Wire solder flux doesn't have enough stomp to burn through the corrosion. That poor ol' stuff
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Thu Dec 09 15:14:41 EST 1999 | Ron Costa
I have been seeing wetting problems with Texas Instruments componets. I am using Kester 596L OA water soluble solder paste. My reflow profile is in spec. for this formula. Has anybody else seen this problem and if so how did you resolve it? Any feed
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