Electronics Forum | Fri Dec 09 07:10:36 EST 2005 | Mity-C
Good Morning, One problem of LF BGA's in a leaded process is the temps required to propperly collapse the BGA balls. If the BGA is LF, the alloy of the balls will not reflow until the temp reaches 217-245 C. SN 63/37 reflows at 183 C. If your profil
Electronics Forum | Wed Feb 08 03:35:58 EST 2006 | GS
100�C) the moisture changes in vapour/gas generating an internal pressure causing in the worst case damages like internal planes delamination, popcorn effects, degassing, ecc. So you can understand why before reflow it could be necessary to backe and
Electronics Forum | Fri Feb 24 10:08:16 EST 2006 | russ
What happens is: we generate a profile that works and it is fine. however, If we run this profile continously say for an ECO upgrade or something where we are not just doing 1 or 2 we find that as we continue on the profile gets hotter and hotter i
Electronics Forum | Tue Apr 25 09:43:35 EDT 2006 | TMC
I am in the process of profiling some 8"x10"x0.063" double sided boards in our 4 zone oven(4 top and 4 bottom heaters). Was wondering if I can create a profile so that the components on bottom side of a board do not reflow while the componets on top
Electronics Forum | Tue Apr 25 10:13:17 EDT 2006 | slthomas
What kind of parts are on the bottom? Small passives are very unlikely (won't unless other abnormal factors come into play) to fall off when reflowed a second time regardless of temperature differential. There is a simple weight/soldered surface ar
Electronics Forum | Fri Jun 09 12:35:00 EDT 2006 | G. eisner
We are finding this diode not reflowing well. We are having tombstoning issues with this part and only this part on different pcbs. The main thing we find is that under a scope there is blow outs as in air bubbles that look like they have exploded. I
Electronics Forum | Thu Jul 06 13:36:37 EDT 2006 | SWAG
We've had much trouble with flex circuits. As previously mentioned, you must have local fids for the board or the BGA itself (if panelized). Other troubles we experience are drilled holes for pinned connectors. Unless the PCB manufactur has some w
Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
Electronics Forum | Sat Nov 04 21:30:15 EST 2006 | Ola
Well, I can't tell you what the "glass wicking failure on PCB" are but for a standard FR4-pcb the Tg temp. or the so called glass temp. is 176 celcius degr. This means that the pcb is in between a firm and a buoyant condition. This is really a bit of
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
.gif)
