Electronics Forum: reflow (Page 366 of 949)

Murata cap wetting issues

Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef

Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes

Solid Solder Deposit

Electronics Forum | Tue Apr 24 10:37:45 EDT 2001 | caldon

A small SMT line? I have conections for a New screen printer (MPM), Essemtec Placement machine, and Reflow oven (Electrovert) for $100K Let me know how interested you are. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org

Calcutating Surface Tension

Electronics Forum | Thu Oct 26 11:30:06 EDT 2000 | lefebvres

How can you determine if a SMT component will have enough surface tension to stay on the PCB during reflow process? I understand there is a formula that will provide this information.

Re: Plastic BGA

Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc

Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity

Indium / Tin Paste Properties

Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F

Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.

residues

Electronics Forum | Tue Aug 22 09:30:18 EDT 2000 | gdiepstraten

With the introduction of new lead-free alloys and higher temperatures to meet their specifications, can we expect different and/or more residues in the reflow soldering process?

flux compositions

Electronics Forum | Tue Aug 22 08:52:39 EDT 2000 | genesmelik

Good morning Dr. Lee. I was wondering how flux chemistries have changed, or will change, with the transiton to Pb-Free, given the higher reflow temperatures required for SMT assembly?

PIHR

Electronics Forum | Thu Jul 20 14:16:39 EDT 2000 | Jeanette

Is the temperature the only drawback when reflowing components other than connectors? for example caps, transformers. Is there a problem with the soldering quality if the body of the component covers the solder paste?

Lead free

Electronics Forum | Thu Jul 20 12:22:57 EDT 2000 | newf

How are Component manufactuers addressing the PB free solder inititive? Since I am told higher processing Temps will be required to reflow the pb-free alloy.

Re: Lead free

Electronics Forum | Thu Jul 20 16:45:37 EDT 2000 | Bob Willis

Many machines for both reflow and wave are quite capable to run lead free but you are generally talking about the high end systems not the light weight units. Bob


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