Electronics Forum | Tue Jan 17 21:31:48 EST 2006 | KEN
Agreed. Some research sugests the "flexibility" of the joint(s) is reduced with flux only resulting in premature failure as compared to standard paste + ball reflow processes. However, this does not mean it is not a reliable method. Relibility req
Electronics Forum | Tue Jan 17 06:45:29 EST 2006 | meritajs
Hi All, Could somebody help us to acguire manual or technical info for solder wave Electrovert Econopak and reflow oven HELLER 1500S Thank you Peter
Electronics Forum | Tue Jan 17 17:29:42 EST 2006 | pjc
Here's a page on tombstoning: http://www.tkb-4u.com/defects/reflow/tombstoning/tombstoning.php Be sure to see this on the bottom of the page: For more info about this item look at the Articles / Newsletter: (Causes and Cures of Tombstoning Chip C
Electronics Forum | Wed Jan 18 17:00:18 EST 2006 | gipos
Can someone help me with Hollis FCR310 reflow owen data. Seems that it is difficult to find anything.After Electrovert purchased Hollis, the support is missing. Where to find user/service manual.....? Any data will be highly appreciated. Thank you
Electronics Forum | Fri Jan 20 13:25:07 EST 2006 | Gary Kemp
The mask/copper layer is exhibiting popcorn blistering following reflow. With profiling we know that the assembly does not see anything close to 250 C, rather around 238 C.
Electronics Forum | Mon Jan 23 15:15:04 EST 2006 | Chunks
Sorry, that was 2 jobs and 12 years ago. Not sure where you can find the material you're looking for.
Electronics Forum | Thu Mar 23 18:46:40 EST 2006 | Chris
Is this a Universal oven or a Vitronics oven? I am confused on your postings. If it is a Universal oven with a touchscreen of 90s vintage, call ETS.
Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Fri Feb 03 13:15:44 EST 2006 | amol_kane
the flux in the solder paste should take care of the oxides. if possible print a board and run thru reflow to check for wetting issues......there are some published papers that say that the tarnish layer is too small to create any wetting issues or o
Electronics Forum | Thu Feb 09 09:45:50 EST 2006 | PWH
I'm not familiar with the HVN70 programming but our conceptronic oven reacts well to adjusting the cooling fan speed at the end of the oven. However, TAL will likely be affected substantially by changing fan speed.
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