Electronics Forum: reflow (Page 726 of 949)

BGA non wetting

Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22

If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making

Hand Soldering SMT Cap ?

Electronics Forum | Sun Oct 03 13:32:54 EDT 2010 | schen

Hi. there's no other way to do except hand solder the top side cap or using hand print hand place method during SMT process. otherwise you will have to spend more time just to set up this process. bottom line is you have to install this one cap first

Lead-free BGA in Tin/Lead Process

Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp

The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders

PCB Solderability

Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh

Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe

Package on Package ( TI: OMAP3503DCBC)

Electronics Forum | Tue Oct 26 16:41:05 EDT 2010 | sai

I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256

0402 Cap tombstoning strange behaviour

Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0

Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i

Best way to ensure max solder load on SOIC w Thermal Pad

Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef

The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p

Reflow oven recommendation

Electronics Forum | Sun Nov 14 20:29:17 EST 2010 | isd_jwendell

I have dealt with Manncorp twice, and both times did not go well, so I do not recommend dealing with them. I use the Mistral 260 and am quite happy with it's performance. However, it does not open like other clam-shell style ovens. I haven't needed

Lead shift

Electronics Forum | Mon Nov 15 02:45:15 EST 2010 | 89jeong

Hello. We encountered a SMD problem on PCB. It is that the lead of photocoupler is shifted after reflow and don't meet the minimum requirement of side joint length. I know this is a defect but what i want to hear the reason and the solution to prev

Seeking Vapour Machine

Electronics Forum | Tue Nov 16 13:00:20 EST 2010 | Shean Dalton

ASSCON offers a range of Vapor phase reflow soldering systems. Available in benchtop, batch, inline, vacuum inline. The US distributor for ASSCON is ATEK at http://www.atekllc.com/html/vapor_phase_.html The ASSCON website: http://www.asscon.de/e


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