Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh
Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe
Electronics Forum | Tue Oct 26 16:41:05 EDT 2010 | sai
I have been trying to get the profile right for this part(OMAP3503DCBC) , but still struggle. I'm using the Herller 1809 MKIII oven. I look at the profile recomended by TI and still issue with the solder ball collaps and wetting. My peak temp @256
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
Electronics Forum | Wed Nov 10 16:19:51 EST 2010 | davef
The 5 thou standoff of your SOIC is probably the minimum. We wouldn't be surprised to see 10 thou. With this, you could have maybe a 6 thou gap between printed solder paste and the bottom of the heat slug. So, you're expecting the rabbit ears of p
Electronics Forum | Sun Nov 14 20:29:17 EST 2010 | isd_jwendell
I have dealt with Manncorp twice, and both times did not go well, so I do not recommend dealing with them. I use the Mistral 260 and am quite happy with it's performance. However, it does not open like other clam-shell style ovens. I haven't needed
Electronics Forum | Mon Nov 15 02:45:15 EST 2010 | 89jeong
Hello. We encountered a SMD problem on PCB. It is that the lead of photocoupler is shifted after reflow and don't meet the minimum requirement of side joint length. I know this is a defect but what i want to hear the reason and the solution to prev
Electronics Forum | Tue Nov 16 13:00:20 EST 2010 | Shean Dalton
ASSCON offers a range of Vapor phase reflow soldering systems. Available in benchtop, batch, inline, vacuum inline. The US distributor for ASSCON is ATEK at http://www.atekllc.com/html/vapor_phase_.html The ASSCON website: http://www.asscon.de/e
Electronics Forum | Wed Nov 17 05:20:38 EST 2010 | jlawson
Also please contact Rehm Thermal, they make best Vapor Phase systems in terms of cost of onwership - less galden usage than Asscon or IBL, have more controllable ramp rate control vs the other vendors also...use patented galden injection on demand an
Electronics Forum | Thu Dec 16 04:14:16 EST 2010 | kemasta
Hi, I am new in this industrial. I learnt that PCB may absorb moisture and eventually caused delaminate after heat apply on it (reflow or wave). But I don't quite understand, if the PCB was keep in sealed bubble bag, and with the humidity control wit
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