Electronics Forum | Sat Jul 16 08:12:44 EDT 2005 | davef
skandaae: By "tilt" do you mean that one end of the 0603 has lifted from the board surface? If so, we call this "tombstone". In general, tombstoning is caused by an imbalance in temperature or forces on the component. * Convince yourself about the
Electronics Forum | Thu Jul 07 18:10:20 EDT 2005 | russ
You should use Xray to qualify your process. Frequency of Xray inspection after that will need to be determined by your process capability. If you use paste inspection process, once you verify that your profile and placement are good you in theory
Electronics Forum | Mon Jul 18 09:35:42 EDT 2005 | stepheniii
If it were other machines I would suggest the possibility of air kiss blowing the solder away, but mydata's have a release to make sure the air kiss never gets too high. Unless it is not pointing 90 degrees away from the machine like mydata recommend
Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil
Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio
Electronics Forum | Tue Aug 02 23:02:04 EDT 2005 | crishan
Assuming it is not PCB supplier related, here are my thoughts; 1. CHK Component density top / bottom, I am assuming you do bottom reflow first then top. If have alot of heavy comps on bottom it might cause the board to sag in the middle. 2. You hav
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Wed Jul 27 11:28:55 EDT 2005 | jh0n!
This may be completely normal, but I'm not used to seeing this with our old SnPb. I'm setting up reflow profiles for a SAC305 alloy, and it seems that on some of our larger pads, the flux seems to pool in the center. Is this perhaps a sign that I'm
Electronics Forum | Thu Sep 01 01:36:23 EDT 2005 | adlsmt
The parts could still be the problem regardless if they came from different lots. If you look under a high mag microscope you should be able to see to some extent if once the lead is gone does it look like the lead plating is gone from the lead and i
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Mon Aug 29 12:52:21 EDT 2005 | pr
We have 2 dual head Versa-flows in line. We use them mainly for doublesided reflow jobs that have connectors and axial parts. I have about 15 jobs currently running on them. The advantage of having 2, is some of our boards have through hole on 1 side
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