Electronics Forum | Wed Dec 12 11:35:26 EST 2012 | rway
I work for an electronics manufacture. Our end product is on PCBAs. My question is related to the use of safety glasses, which I know are required when doing rework. But here is the question: We ordered side shields for prescription glasses. Wha
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Mon Jul 01 13:25:31 EDT 2013 | tpost
I think it is wetted also but I cannot verifiy without actually seeing the toe, heel or side fillets. In this case, the lead was overhanging the pad and as with this type of lead it is not acceptable so they were reworked. Many times rework personel
Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera
My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have
Electronics Forum | Fri Jan 30 06:14:01 EST 2015 | philc
And there is always the argument of "get in and out quick", which is possible with high tip temps. I prefer to use a really hot iron, and do it quickly, rather than a lower temps and keep the tipi on the bit till it melts the solder. If you have a P
Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs
That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o
Electronics Forum | Tue Jul 25 16:59:54 EDT 2017 | spitkis2
Is anyone reworking BGA parts with an rf shield on top of the package? Any problems getting it off the board? I am running into an issue in that the shield comes off but the part remains on the board - not because solder has not reached melting but
Electronics Forum | Tue Dec 12 19:57:56 EST 2017 | myke03o
Hi Experts. We have an expired OSP pcb and we wanted to extend the shelp life. Is it possible to rework the PCB by removing the OSP coating, micro etching and re-applying OSP finish. Any advice if this can be done? Any solution for this OSP pcb e
Electronics Forum | Tue Nov 06 08:26:54 EST 2018 | bandjwet
We are considering a tabletop AOI primarily for rework purposes. In 95% of the cases we would NOT have centroid data NOR Gerbers, The area we would inspect would be in and around the BGA, QFN or LGA being replaced. In addition we would want o inspe
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