Electronics Forum: rf chip (Page 1 of 3)

Reflow issue with QFN

Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10

It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often

Re: MI Solder temp & RF routing

Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack

First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o

MI Solder temp & RF routing

Electronics Forum | Sun May 10 06:40:28 EDT 1998 | PhingMae

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What is the consequence?

Flux residue effects on circuit performance?

Electronics Forum | Mon Apr 15 18:59:12 EDT 2002 | davef

Points are: * Seminal study is: "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia National Labs in June 1995. Look here http://www.smtnet.com/forums

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny

Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro

Need Help for EMI Shielding process

Electronics Forum | Fri Nov 11 18:06:15 EST 2005 | pyramus

Thanks for the reply everybody!!! It is a compact RF device it is currently being designed our R&D is asking some suggestions what kind of shielding would be best for it. It is quite compact that we will be using 0201 chips on it. Anybody have exper

Chip Component Stacking

Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob

Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap

Re: MI Solder temp & RF routing

Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What is the con

Re: MI Solder temp & RF routing

Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes

Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What

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