Electronics Forum: said (Page 56 of 180)

Re: Convection Oven Reflow Modeling Simulations

Electronics Forum | Thu Feb 17 22:23:15 EST 2000 | Dave F

Richard: As Roni said, most of the better profiler companies have the capabilties you seek Datapaq,187 BallardvilleSt,Wilmington, MA 01887 508.988.9000 Michael Dougherty Electronic Controls Design, 13626 SFreeman Rd, MulinoOR 97042 503.829.9108 K

Site Search and Netscape

Electronics Forum | Thu Jan 18 09:00:38 EST 2001 | bdoyle

Thanks to the emails and posts I've read I think I've narrowed the problem down. Its a Netscape issue (which is why when people first initially said they were having problems it was working for me.) I'm working to resolve the issue. In the mean ti

Round Solder Lands

Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC

Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac

AOI systems

Electronics Forum | Fri Mar 30 14:43:55 EST 2001 | larryk

Phil, The AOI will do a excellent job doing what you said you are looking for. We justified ours on the same requirements as you stated. Keep in mind that the machine may not "see" everything, there are some hidden joints that you will still need to

Solder Paste Volume

Electronics Forum | Tue Apr 10 16:18:06 EDT 2001 | davef

What time? An in-line bot with a vision system tuned for paste recognition can measure a different portion of each board and keep pace with the placement machine all day long. I don't understand what you guys propose as an alternative. Realistical

Blow holes on radial parts solder joints

Electronics Forum | Thu Apr 05 22:27:06 EDT 2001 | davef

As a band-aid, consider running your chip wave when soldering these boards [Similar to Cals "dance with me babe" suggestion.] If the problem is as broad based as you say and the radial components have a tight fit, consider increasing the holes by a

Wet behind the ears

Electronics Forum | Tue May 01 23:06:07 EDT 2001 | djarvis

Mate, I'd love to but we are not allowed to use ENIG (Empaestic Noumenal Ideopraxistical Gunk) here so I really couldn't enter into the debate. Surely people realise that your average SMT boffin is a mental case in a blue coat. I looked up "SMT-engin

orange peel effect on solder joints

Electronics Forum | Thu Jul 20 16:45:54 EDT 2000 | Darby

Good morning Bob. Darby from Australia here. We sometimes see an orange peel type finish on our reflow solder joints when viewed under the microscope. Any ideas on what causes this ? Should I worry about it. I use a straight rise profile ( no "platea

Who can recommend a reliable solder volume measurement m/c?

Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon

PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w

Who can recommend a reliable solder volume measurement m/c?

Electronics Forum | Wed Sep 12 18:08:15 EDT 2001 | davef

I missed the laundry part [but then again, I couldn't figure-out that "AMT" as THE typo] That aside, I have no problem with what Cyber said. Continuing, we have talked about all of the following issues in previous threads on SMTnet: * LSM 300 does


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