Electronics Forum | Fri Aug 24 15:18:51 EDT 2007 | consultacionbc
Stephen, This is a board designed for medical apparatus and we're needing to change 3000 placements, it's about 2000 different parts. Some boards have about 90 parts and some have greater amount. Impedence of the board happens to be a great issue
Electronics Forum | Mon Oct 22 11:40:24 EDT 2007 | aj
Hi All, While I will carry out a search of the archives when I get a chance, I would like to hear from anyone using AOI. I am currently looking for a 2nd user machine . A couple of the main factors I will be considering is ease of programming and l
Electronics Forum | Mon Nov 12 08:04:15 EST 2007 | samir
In my past life, I used a tooling plate by JNJ that is specifically made for MPM's. The theory is - it's an alphanumeric grid, like Battleship, where you figure out your setup once, and then document it. It worked with and fit nicely with the MPM H
Electronics Forum | Wed Jan 16 04:16:11 EST 2008 | grantp
Hi, That's great, and I did not know this was possible, as I did not see that thread when I searched the archives. Do you know of any companies that take your board outline and will design a palette to hold it through the printing, smt loading and
Electronics Forum | Mon Jan 28 13:20:48 EST 2008 | tonyamenson
New to thermal profiling (leaded and lead free), and my boss wants me to search for a better profiler. Currently our model has three ports for thermal couple inputs. We are established in our noraml process but we are relatively new to incorperate m
Electronics Forum | Fri Mar 07 10:55:51 EST 2008 | slthomas
Not sure if you need help with the calculations or the application, so from the beginning: d=defective parts, p=number of parts, dpm=defects per million parts In a nutshell, d/p=dpm/1000000, so dpm=d/p*1000000 We use dpmo (defects per million op
Electronics Forum | Fri Mar 21 12:39:52 EDT 2008 | stevea
Paste Inspection is critical to the overall printing process. There are at least 40 variables to this process. The idea of using only 2D printer inspection or worse yet, 3D (marginal at best) printer inspection demonstrates a serious gap in coverin
Electronics Forum | Mon Mar 17 04:31:52 EDT 2008 | d0min0
Hello, tried searching the SMTnet archives, but not yet a clear answer - maybe there is not a one yet ? ;) last discussion I found is few years old so maybe there is a fresh view on that? Q: we want to prove that our proces is "clean" we use SAC30
Electronics Forum | Mon Mar 24 22:53:22 EDT 2008 | davef
As you say, just about defect can be tied to process, one way or another. If you want to think about it, search the fine SMTnet Archives for background on barrel cracking. Other things are: * How thick is the actual via plating from the two supplier
Electronics Forum | Thu May 15 19:36:56 EDT 2008 | davef
Q1: static or dynamic? A1: search the fine SMTnet Archives. For instance, http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=44837 Q2: localized testing (C3) or bulk testing (Omegameter/Zero Ion)? A2: depends on the contamination that you're
