Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Fri Oct 29 15:43:43 EDT 2004 | glaucon
Forgot details: Use a sample product that you will be running in production. Let each Equipment vendor run a test to meet your requirements. Often with each of these machines (MPM/DEK/EKRA) the key machine features are: -2D Inspection (for minimiz
Electronics Forum | Sat Dec 04 18:55:38 EST 2004 | Grant
Hi, Yes, all you really need to do is boil the fluid while suspending the PCB above the vapor, so it's quite easy. However I would recommend against dropping the board direct into the vapor cloud, as that would be a very fast warm up, while letting
Electronics Forum | Sun Dec 26 21:18:04 EST 2004 | tellinghuisen
Chris, We also do not allow the use of Lead-Free BGAs in a lead based process. It is actually one of the things that scares us most about converting to Pb-free. Most of the suppliers that we have talked with are planning on moving to the SAC
Electronics Forum | Wed May 18 14:58:05 EDT 2005 | splice
Hi, I am having some PTH non wetting issues. Setup and chronology of events is explained: Set Up; Part: 1 MM pitch connector 378 pins Solder: Kester Ultra Pure 63/37 solder Pot; 250 C pre heat; Peak 94C top side Flux: Qualitek 775, Fluxer: foam T
Electronics Forum | Tue May 31 18:08:45 EDT 2005 | K
All good points and thank you for your replies. Most of the components lost are discretes. The problem I have is my operators gather any SOIC "lost components" and return them to stores in a small metallised bag. This in turn goes into a 16" X 12" X
Electronics Forum | Thu May 26 15:28:41 EDT 2005 | jh0n!
It looks like there's another one or two threads somewhat similar, but allow me to pose another. We've only about two years experience in SMD production, and we're just starting to really ramp-up. As we stand right now, I'm not recieving informatio
Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Wed Aug 17 14:18:11 EDT 2005 | ppwlee
Dave, Answers to your questions: * From your pictures, the white residue appears to be only on the solder mask. Is that correct? If not, what is the location [eg, solder, nonsolder/nonmask areas] of the residue that doesn't show well in the pictur
