Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Mon Jul 26 18:01:30 EDT 1999 | Earl Moon
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Mon Jul 26 18:05:18 EDT 1999 | ScottM
| Presently protos of micro-bgas (80i/o) pitch .030/.031 | 12BGA per assembly | | The board is a (.062, 4 layers) FR-4 using Dry film | Pads .014inch | Vias within footprint .020inch | Vias to be filled by bottom side(solder side) only .030in dia. F
Electronics Forum | Wed Jul 28 19:27:57 EDT 1999 | Ed R
| Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers some printers in that price range, but are they holding any real market share in that niche? | |
Electronics Forum | Fri Jul 23 14:07:52 EDT 1999 | Carl J. Odle
We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after a p
Electronics Forum | Wed Jul 28 16:05:12 EDT 1999 | Rob Fischer
| | | Just go look at the thread on stencil cleaners started by Scott Davies in the March 1-15, 1999 achives if you want to see some juicy stuff...then make your mind up about vendor inputs. Pretty obvious if you ask me... | | | | | | -Steve Gregory
Electronics Forum | Wed Jul 21 20:52:52 EDT 1999 | Scott
| | I have pcb's in which i am experiencing warping. | | the boards are 12.8125" on a diagonal measurement. | | they are out approximatley .010". | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what i
Electronics Forum | Thu Jul 22 06:54:45 EDT 1999 | Earl Moon
| | | I have pcb's in which i am experiencing warping. | | | the boards are 12.8125" on a diagonal measurement. | | | they are out approximatley .010". | | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,an
Electronics Forum | Mon Jul 19 11:11:18 EDT 1999 | Wolfgang Busko
| Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still t
Electronics Forum | Mon Jul 19 11:50:47 EDT 1999 | Mario
| | Hi, SMTASSY | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | First, we do not do real series produktion, only prototyping up to sometimes 20 uni
