Electronics Forum: seeing (Page 376 of 728)

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat

We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 14:52:18 EST 2008 | wrongway

We run our process like that all the time paste then glue we use same profile as if we were just reflowing paste once in a while we have A plastic bodied part that has that problem we asume it was some mold relase still on the part basicly comtamena

BGA failure at Functional Test

Electronics Forum | Fri Jan 16 14:42:44 EST 2009 | realchunks

Kester R562 is a 63/37 paste. Not ideal for no-lead parts. I bet you are seeing no-lead BGAs and they will become very weak using your old proile and paste (been there - done that). You can try a hotter profile but will probably just burn off your

Quick Turn Around for an EMS Provider - Brainstorming

Electronics Forum | Thu Jan 15 14:16:29 EST 2009 | rgduval

I'd agree. I wouldn't be able to turn significant volume in that short a time span....but, then again, I don't see a lot of people that need significant volumes in that sort of time span. And, agreed on turn-key. I've done a couple of tk jobs in t

What will happen if a sloder paste is used after 24hours

Electronics Forum | Tue Jan 20 07:57:00 EST 2009 | mrdtech

Depends on the solder paste. If it has been on the stencil for 24h there is a good chance that the paste is destroyed. You can however check if it has not dried out too much by letting the stencil printer do a few strokes and see if the paste still h

Is This Corrosion?

Electronics Forum | Tue Jan 20 17:51:24 EST 2009 | davef

We'd guess that since your board fabricator could not remove this stuff with it's HAL-leaded process, you're unlikely to remove it with your soldering process that is likely to be pansy-ass compared to your fabricator HAL process. Hey, why not run a

Using Injet Printer on Juki KE-740

Electronics Forum | Tue Jan 20 13:42:21 EST 2009 | jti

We have a Juki KE-740 I would like to use a HP-612 Inkjet printer instead of a dot matrix printer to print out the production info, is this possible, I don't see the option to load printer drivers on the menu, and the Inkjet doesn't print correctly.

TSOP lead deformation (help)

Electronics Forum | Mon Jan 26 10:15:51 EST 2009 | john123

Can anyone help me determine the acceptability level for lead deformation (see attachment). The outer two leads on the left side were bent during the pick and place centering operation. I've looked in the IPC-A-610 book and could only find informa

TSOP lead deformation (help)

Electronics Forum | Tue Jan 27 02:00:40 EST 2009 | sachu_70

Your image does not clearly explain the problem. However, I can see a good heel fillet formation at the joint. In general, TSOP leads are delicate and should handled with immense caution and good ESD protection. First let us be clear that any "rework

lead free joint finish

Electronics Forum | Thu Jan 29 16:51:57 EST 2009 | gregoryyork

Hi Small ovens work fine if the settings are correct and I seriously doubt 55cm/min is right. Profile it and speed down to around 35cm/min. Increase first zone to around 170 keep second at 208 but increase last to around 280 BUT profile to check it


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