Electronics Forum | Fri Aug 06 17:28:06 EDT 2004 | Steve
My suggestion is that there are alot of suppliers for this type product. Call a couple of distributors and have them send you samples. Make sure you know each manufacturer so that they don't duplicate. Review the performance and price of each one and
Electronics Forum | Fri Sep 03 11:45:15 EDT 2004 | rlackey
Hi Ken, I know this doesn't help in the immediate timescale, but isn't avoidance the best form? can you trace the cracking to a process issue (Solder profile, shock damage, handling damage, probe/ATE damage)or a chip cap manufacturing fault? I can'
Electronics Forum | Tue Oct 05 16:02:04 EDT 2004 | Bryce
I am curious if anyone can help explain to me the cause of an effect we are seeing with some failed caps. The parts have been found to be cracked and in most cases are hard failures (capacitance well out of spec and DCR less than 100 ohm or shorted)
Electronics Forum | Mon Nov 22 11:19:39 EST 2004 | davef
Short answer: Yes. Depending on the application of the conductive ink, suppliers select different mesh for the silver particles. So, you should follow your supplier's recommendations for printing, for instance: Conductive Ink||PI-2000 Highly Condu
Electronics Forum | Sun Nov 21 21:40:13 EST 2004 | John
I'm experiencing an impedance breakdown on an 0805 ceramic cap. In the application, the cap is at a 16V bias at all times. The unit failed in an extremely high humidity condition. We are using a NC flux and have determined there was flux underneat
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ
Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win
Electronics Forum | Mon Jan 31 07:36:54 EST 2005 | Nifhail
Hi all, In general, I am looking at restructuring of our rework processes in our factory. Despite all the effort put into design, process, material etc, there will always be some assemblies that must be repaired. Over the years, alot of hi-technolog
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Mon Feb 07 09:03:15 EST 2005 | Chunks
This paste does tend to solder ball - but short of changing paste you can change your stencil to accommodate it. First, why 10 mils? Seems very thick. What size parts are your working with? Typically you can �homeplate� the R�s and C�s and this
