Electronics Forum: side (Page 151 of 509)

radial/thru_hole insertion

Electronics Forum | Mon Mar 12 22:05:49 EDT 2007 | long

i'm a new guy in thru_hole insertion technology. have any one know any web that i can go through to get more knowledge about this tecnology (especially in technical side).

Problems with Maxim TQFN 38 pin part

Electronics Forum | Wed Mar 14 13:52:11 EDT 2007 | Oswaldo Rey

Vias are thru hole, pcb is two sided, bottom copper is 2 sq inches, vias are 0.6mm diameter. thanks,

soldering thru-hole SAC305 component

Electronics Forum | Fri Mar 16 08:01:53 EDT 2007 | ck_the_flip

SAC coated leads on certain components require more dwell time. If you find that you have top-side wetting issues, slow the conveyor down a bit or increase your wave height, or, a combination of the 2.

Storage

Electronics Forum | Mon Mar 19 07:59:52 EDT 2007 | realchunks

Hi Chrissie, Can you add breakaways to your baord? If you have all 4 sides with components then you'll probably need custome carriers.

Double-sided boards

Electronics Forum | Thu Mar 22 20:38:58 EDT 2007 | davef

Try: * Printed Circuit Design & Manufacture magazine http://pcdandm.com/cms/ * IPC http://www.ipc.org * Frost & Sullivan http://www.frost.com

Double-sided boards

Electronics Forum | Tue Apr 03 07:37:43 EDT 2007 | davef

Look here: http://www.circuitree.com/CDA/Articles/Column/BNP_GUID_9-5-2006_A_10000000000000075772

QFN Recognotion Problem

Electronics Forum | Fri Mar 23 07:39:34 EDT 2007 | namruht

I have tried to teach the part a couple of different ways. I have the component taught as a Quad Flat Pack and I am ignoring two of the sides. This has provided better results but still not consistent.

Heel bend wetting for Gull Wing lead

Electronics Forum | Thu Apr 12 20:44:58 EDT 2007 | raychamp007

If the solder joint meeting 8.2.5.4, minimum side joint length(D) and also meeting 8.2.5.6, minimum heel fillet height (F) but the heel fillet NOT extend to the mid point of outside bend. It is acceptable?

Ag/Pd termination reflow soldering issues

Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray

I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?

Quoting Software suggestions please!!!

Electronics Forum | Wed May 09 13:47:24 EDT 2007 | Frank

So if you are getting 100% consignment parts on a single sided board, then you are doing it all for free and getting 3-dollars for a doubled board? Wow, that is pretty cheap.


side searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

High Resolution Fast Speed Industrial Cameras.
SMT Machines

High Throughput Reflow Oven
SMT feeders

High Precision Fluid Dispensers
Assembly Automation Technology

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...