Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Fri Nov 30 17:33:12 EST 2001 | slthomas
After saying for years that we'd never do two-sided assembly, the powers that be are not only saying we will, but they're threatening to throw an out of house design at us...no frame (it's a PCI card with a couple of dinky breakaway tabs), no tooling
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B
Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets
Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc
I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to
Electronics Forum | Thu Aug 26 00:27:45 EDT 2004 | valuems
There is so much confusion about this cognex not reconized statement, and it's time to step in. The box on the out side is a cognex 2000 system. The reason for the cognex not reconized statement is very simple. MPM wrote the 4.1y software looking
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Mon Jun 05 14:01:48 EDT 2006 | Brian
I have used, Siemens, Juki, Fuji, Universal, and Assembleon. All of them can do the job, depending on the machine mix selected. I personally prefer MPM screenprinters, after using both DEK and MPM. BTU, Vitronics, Heller, and Ellectrovert all make
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
