Electronics Forum: side (Page 306 of 509)

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Tue Jul 08 22:44:06 EDT 2008 | proy

I made progress and almost acceptable results by adding heat to the bottom of zone 4 HOWEVER, the core problem I uncovered last night/this morning was that the #4 top side blower had failed. I think this is the key why I was having so much trouble.

Land size

Electronics Forum | Tue Jul 22 20:14:34 EDT 2008 | stevek

It's been my experience that most flat pack land patterns have far too much exposed toe. It accomplishes nothing for the reliability of the solderjoint. And often the ends of the leads are sheared and not very solderable anyway. Anything more than

Solder Mask Bubbling On PCB from Supported Via Holes

Electronics Forum | Mon Jul 14 12:55:07 EDT 2008 | arminski

I have a board with the above problem from our PCB supplier. After they applied the solder mask and run the PCB's to HASL process, the solder mask bubbled on one side of the PCB making the solder mask thickness higher and PCB looking awkward. They s

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

ive solder profiles

Electronics Forum | Mon Aug 04 16:28:49 EDT 2008 | grics

Hey Patrick, thanks. The area that is dark (half circle) is where the camera was. It is the same color as the above. But you may be correct still. I also noticed that the majority of the solder balls were along the "Dark" blue depression around the

Pogo Contamination

Electronics Forum | Thu Aug 14 10:54:21 EDT 2008 | diesel_1t

Comments are: * Link you posted to your brush > actually connects to a general catalog page. * > Not sure what solders your friend was using, but > pastes leave different residues that affect > probing. Some are soft and gooey, others are hard >

Solder not reflowing properly

Electronics Forum | Thu Aug 28 18:48:49 EDT 2008 | markhoch

You're using a SAC305 chemistry? Double check your liquidus temp! Your profile shows a liquidus temp of 217 degrees C. SAC305 is not eutectic. (It doesn't transition from paste to liquid instantly). It goes thru a "pasty" stage. We use a temp of 221

New Printer :- Dek Horizon 03i or MPM 125 ??

Electronics Forum | Thu Oct 02 08:09:04 EDT 2008 | pwilson1

Hi All, I am currently in the process of selecting a new stencil printer and have narrowed it down to the MPM125 or DEK Horizon 03i.. We re a UK medium volume production facility running quite a high mix of double sided PCB`s. W

SMT Connector, Placement Issues

Electronics Forum | Mon Oct 06 14:10:55 EDT 2008 | chineechooze

0.001969" You say that 0.008" of "slop" is un-doable; hence, the reasons for our failures. Any basis for that statement? Are rated accuracies from placement equipment manufacturers typically "exgaggerated?" 2. On PCB Fab side of things, what is

RF board not soldered

Electronics Forum | Sun Oct 19 15:02:10 EDT 2008 | Jdt13

We are having some issues with a RF PCB aprox 1" x 1". The pads are in the bottom of the PCB and it goes on the Top side of the mother board the pads of the RF board are like a BGA (square pads)and we have troubles to make the proper welding in the


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