Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
Electronics Forum | Tue Mar 19 11:52:25 EST 2002 | davef
We have had Corfin recommended to us, but have never needed to use them. Also consider: * EMPF uses a ROSA process for solder rejuvenation. Check with Cal [at Manncorp, a SMTnet regular] for the scoop [chocolate, vanilla, or ROCKY ROCOCO] on EMPF.
Electronics Forum | Mon Dec 09 20:34:20 EST 2002 | MA/NY DDave
Hi I hear you, and you are right, yet most good process engineers strive to make future life a little easier by going back to the designers and making some alterations that don't affect performance. Now if we did a 6 sigma type analysis than this p
Electronics Forum | Fri Aug 22 10:20:26 EDT 2003 | Stephen
I hate being persnickity, I just am sometimes. You are not being told you "should expect" that variance. You are being told you can't sue them for manufacturing defects if the balls are within that range. That range is way bigger than what they wil
Electronics Forum | Tue Jun 29 13:42:20 EDT 2004 | sigmaprint
You will need to set the contact and squeegee zero calibration every time you set up a new product, we do this because the thickness of the substrate (pcb) can change between product and this will effect these calibration settings. The machine does n
Electronics Forum | Thu Aug 19 13:29:43 EDT 2004 | davef
Things we�d like to have in a reflow oven are: * Small variation in temperature [+-2*C] from rail-to-rail. * Consistent temperature over time [3+ sigma]. * Thermal inertia / fast recovery to be able to respond to the effects of high mass boards. * Ra
Electronics Forum | Tue Dec 13 06:56:27 EST 2005 | adanhn
Hi Steve, What I came up with for our Soltec Sigma 6621 is to make a stainless steel wave solder bath insert.The insert with all its components eg. impeller, Chipwave assy, pump shafts, main wave assy etc. I will send for plasma nitride coating.Afer
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Wed May 17 23:59:16 EDT 2006 | KEN
Repeatability data please. Please provide source. Can you provide the standard deviation and sample size please. Does this data represent all major angles? Was this data independently verified? Was this data collected using glass parts or p
Electronics Forum | Wed Dec 06 16:27:35 EST 2006 | mscalzo3
We would be able to help you in any way that we can. There was an article in SMT magazine that explains a lot. Also, we have data on other processes that have successfully done this conversion. This has been a popular way of eliminating the conver
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