Electronics Forum: slip and sheets (Page 1 of 5)

MY15 and MY19

Electronics Forum | Wed Apr 28 23:18:09 EDT 2004 | Grant Petty

Hi, Ours are inline, and depending on how you have the conveyers, you might need to use the data sheets to work out placement. If your running the conveyers behind the machine, then most of the machine is in front of the conveyer, so they use more s

Wave flux and profiling

Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir

Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll

Pick and Place Nozzles

Electronics Forum | Mon Aug 18 22:55:05 EDT 2008 | kpm135

Nozzles are really machine specific. Your best bet, if you're looking for the correct nozzle for a part, would probably be to send a strip of parts and the data sheet to the manufacture of the machine and ask them for their recommendation. Most machi

Yamaha pick and place

Electronics Forum | Tue Apr 10 02:57:53 EDT 2018 | rob

Yes I would, most of our old Yamaha machines (before 2005) will do 30-35 microns @ 3 sigma with the fine camera option. Our Jukis with His res camera's will hit it too. You should be OK with most things after 1997 with the right camera choice (whic

Circuit cam and mydata

Electronics Forum | Fri Mar 27 12:46:23 EDT 2020 | unisoft

Unisoft has been import gerber only for years to setup assembly, aoi machines, etc. *** Help for Importing GERBER only files for used in programming Assembly, AOI, Test, Selective Soldering machines (X/Y Center, Rot, Part#). Also allows you to cre

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 21:20:59 EDT 2012 | action_101

Interesting thought. Our paste is 89.2% according to the data sheet I have, but it still might be worth trying the 84-86% syringe blend. Thanks for the suggestion.

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 16:52:39 EDT 2008 | tonyamenson

Indium got back to me with the attached PDF. I always assumed, that in order to avoid thermal shock, there could not be any more than 80 degrees C difference between the solder pot and the pre-heated board. However, it would seem that any thing le

Solder beads and wave soldering

Electronics Forum | Mon Jul 10 09:25:47 EDT 2006 | nodlac

Here is a nugget from the Data Sheet... Wave Soldering: Excess moisture on the PCB during soldering may lead to random solder balling and poor wetting of some solder joints. IT IS IMPORTANT that the flux solvent carrier (water) is fully evaporated a

Samsung SM421 and 01005 components

Electronics Forum | Fri Aug 16 09:35:54 EDT 2013 | leemeyer

I am doing some research on Pick and Place machines and have found the Samsung brochure a bit confusing. Specifically I am looking at the SM421, some of the information I am finding states that this machine is spec'd to place 0201 and up. On the same

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

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