Electronics Forum | Fri Nov 21 07:57:40 EST 2014 | deanm
Everyone deals with a number of loose SMT parts during production. These usually come from machine attrition (dumped parts), a few parts that are lost during feeder tape changeover, dropped inside the machine, etc. I will categorize them as: A. Ide
Electronics Forum | Tue Oct 30 15:04:36 EDT 2018 | SMTA-Shafiq
Steve, Part numbers with the same specification are not part of the same BOM. Scenario is, SMT Line #1 builds Products X, Y and Z Product X has a part number #1 that is a resistor with 50 ohm value and a power rating Product Y has a part number #
Electronics Forum | Thu Sep 09 15:40:21 EDT 1999 | Scott S. Snider
| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What
Electronics Forum | Thu Jul 18 17:29:18 EDT 2002 | pjc
Forget what the machine's max. placement cycle rate is spec'd for. For each board you assemble time the actual placement rate. To do this start the stop watch the instant the camera is positioned over the first fiducial on the first board, then stop
Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Thu Jul 18 11:57:19 EDT 2002 | pjc
For component loss that cannot be accounted for by the placement machine's computer I would have the operators collect all loose components from the feeder setup area and in and around the placement machines after each product batch run. This is cert
Electronics Forum | Fri Nov 01 09:35:52 EST 2002 | James Bartlett
MINIMUM NDSU EMEG EQUIPMENT SPECIFICATIONS (11/1/02) To serve microsensor research and development via the Center for Nano-scale Science and Engineering (CNSE), the North Dakota State University (NDSU) Electronics Manufacturing Engineering Group (EM
Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t
Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th
Electronics Forum | Thu Jul 04 17:48:28 EDT 2024 | assuredtech
I don't know who manufactures the SMT 460 machine or what it's capabilities and configuration or machine settings are applicable to this topic but some common process of eliminations are: Component packages (doesn't seem to be an issue here), Board s
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