Electronics Forum | Wed Mar 12 10:04:20 EDT 2014 | globalpowerproducts
We had a SMT specialist come in and go over everything we were doing wrong! We were dipping the boards rather than spraying them, had the pre-heaters set way to low, the conveyor was going too fast, and the actual wave was in the machine the wrong wa
Electronics Forum | Wed Mar 12 15:26:46 EDT 2014 | dan_ems
Hello, in my SMT process I have some problems with the solderability (look like dewetting) on a PCB with finish HASL Lead Free with a composition that is melt at 230 degree Celsius. My oven is with vapor phase and the peak temperature is 230 degre
Electronics Forum | Sun Mar 30 02:01:46 EDT 2014 | alexeis
Hi, Our customers have SIPLACE SX1, IPulse and Samsung that are used for same needs as yours. Also, they have a software tools from us that decrease a time for SMT setup preparation as new (QPlan/QPlace) or as update of ECN/ECO (QPlace UPD). You ca
Electronics Forum | Sun Apr 27 04:16:55 EDT 2014 | alexeis
Hi, We have developed solution called EMethodSheet. It allows you to create colored map based on CAD (or SMT machine data) and BOM. You can add different functions in different colors for a components. Also, you can add pictures of extra components.
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Tue May 06 09:28:13 EDT 2014 | swag
I think I know what's going on. It's an Engineer thing. I'm a Mech. Engineer that designs and builds tooling + services machines in-house. I order thousands of dollars of material and parts every month but at no time have I added a $6 set of allen
Electronics Forum | Tue Apr 29 15:04:08 EDT 2014 | gregcr
Hi All, We will be building out a new production area and am looking for your opinion on what flooring system to install. We currently use ESD VCT tile that was installed about 16 years ago. The area will be SMT equipment as well as some assembl
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Wed Jun 04 10:51:28 EDT 2014 | clydestrum
Well, we cannot make the cuts any deeper as then we would incur a significant amount of "bowing" at SMT placement/reflow. -Has anyone ever heard of changes in material/laminate makeup that causes this? A sort-of stronger, or more flexible tensile st
Electronics Forum | Thu Jul 10 15:03:57 EDT 2014 | alexeis
Hi, An answer to this question is very complex. The amount of components and their type is only one parameter to determine the level of failure. Additional parameters that can influence are: 1. The density components on the card 2. Machine type and
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