Electronics Forum | Wed Aug 17 21:58:35 EDT 2005 | plcc
Does anyone familiar with COB process? I hv a PCBA product with one of the photodiode (size 26mmx1mm) which needs to be bonded directly on the pcb using COB technology. The wires that need to be bonded are 2, goldwires for about 100microAmp current.
Electronics Forum | Sat Aug 20 15:22:26 EDT 2005 | Jaya
Hi There, Good Day 2 Every1.:) I'm in mid of issue of SMT Components (Resistor & Capacitor) Turn Yellowish issue after reflow oven. Is there anyone have handle this issue previoslly and what is the reason behind the components behaviour in such. Can
Electronics Forum | Mon Aug 22 04:55:06 EDT 2005 | javi
Hi, Need some assitance from people that have experience with qualification for Lead-Free SMT process. We are in a phase to qualify Lead-Free process to one of our new product. The BOM - build of material is complete but we missing some passive com
Electronics Forum | Mon Aug 22 09:01:09 EDT 2005 | iwan
Well guys, I just buy a brand new solder paste softener Malcom type SPS2, I've tried with this with this viscosity result. I Use Almit Solder Paste Lead Free LFM-52X 1 min : 264 pas. 2 min : 272 pas. 3 min : 277 pas. I use standard for Viscosity 20
Electronics Forum | Tue Aug 23 16:57:29 EDT 2005 | HOSS
50% of seeing it in a single pass. The only time we do this is if we have a board off the line that has delaminated. We'll run a sample of boards through bare to confirm that we have a bad batch. Even if we see no failures on the bare boards, we'l
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Fri Sep 30 10:13:54 EDT 2005 | Cmiller
We are having a random problem with boards bowing significantly. Its a large through hole board with only one QFP on it. The bowing occurs during the SMT reflow. The only conclusion I can come to is a problem at the board house that made it. I just w
Electronics Forum | Tue Oct 11 04:08:23 EDT 2005 | Rob
Hi Nuez, We've run a number of different brands of SMT Elco's through a number of leadfree temperature profiles, and consistantly the best performers were Elna & a very similar own brand product (not listing here as it was one from a sister company
Electronics Forum | Fri Oct 14 14:09:19 EDT 2005 | bschreiber
Your problem is not the 0.4 pitch. Your problem is the manual cleaning. Manual cleaning will only remove the solder paste from the surface of the stencil. What's more, manual cleaning will force additional contamination into the 0.4 pitch apertures
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