Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
New Equipment | Solder Materials
WE HAVE BGA SOLDER BALLS, SOLDER SPHERES. Sizes from 0.20mm and up. Quantities from one to one million or more. Available in Lead & Lead Free Solder. One price for Lead, (Sn63Pb37) or Lead Free, (Sn96.5Ag3Cu0.5) in any of these listed solder ball
New Equipment | Solder Materials
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solde
Electronics Forum | Mon Sep 12 15:04:50 EDT 2022 | arminski
Will there be solder joint integrity issues if in Using Sn60/Pb40 on Sn63/Pb37 processed PCB during Rework? Thank you
Electronics Forum | Fri Oct 28 06:46:11 EDT 2005 | james
We used AIM water Soluble Sn63/Pb37 and it tend to be very tacky.
Used SMT Equipment | Soldering - Wave
Operating System: Windows based Details: • Dual pot-Lead and Lead Free • Includes full pot of Lead Free –SN100C solder and Lead SN63/PB37 solder • Carbon Steel Solder pots with high temperature protective coating • A
Used SMT Equipment | Soldering - Wave
Technical Devices NU/ERA 16MP (EXCELLENT CONDITION) L and V fingers Internal 9500 spray fluxer dual wave Full of Sn63/Pb37 solder finger cleaner top side tunnel roll out solder pot Like new condition
Industry News | 2011-04-29 21:09:25.0
FCT Assembly announces that it received an appreciation award during a dinner ceremony hosted by Nihon Superior Co. Ltd. on Wednesday, April 13, 2011 during the IPC APEX EXPO in Las Vegas.
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Technical Library | 2007-11-15 15:54:44.0
At the contractor level once a product is required to be soldered with lead-free solders all the processes must be assessed as to insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow, wave soldering and hand assembly processes must all be optimized carefully to insure good joint formation as per the appropriate class of electronics with new solder alloys and often new fluxes.
Technical Library | 2015-02-12 13:32:52.0
Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility.
