Electronics Forum | Tue Dec 07 10:12:53 EST 2004 | jdumont
Morning all, can anyone recommend a wave soldering oven for use with lead free bars? Our trusty 20 year old Treiber wont make the grade without costly upgrades. Its time to let her go and buy into new technology. Any help would be appreciated. Thank
Electronics Forum | Tue Feb 01 11:33:26 EST 2005 | Indy
Hi Jay, please let us know your inputs from the seminar regarding SN100 Nihon solder from FCT. This solder seems to have a higher melting temp of 221C. It prints well and visually looks similar to SAC alloy. Have no reliabilty data though. Jay
Electronics Forum | Wed Apr 27 15:14:12 EDT 2005 | andymackie
The viscosity decrease on warming is one of the main reasons, but you also don't want to get moisture condensing on the surface of the paste. Activators in the paste (that are used to eliminate solderballs and enhance solderability on reflow) become
Electronics Forum | Wed Feb 14 10:10:55 EST 2007 | rob_thomas
The challenge regarding the stencil was mostly due to the actual board layout and nothing having to do with the voids in the solder. It was my first encounter with 0.5 mm pitch on BGA and dealing with a LF solder paste with higher viscosity than tha
Electronics Forum | Tue Sep 21 08:44:08 EDT 2010 | fnorradd
Hi Guys, Quick question, does anyone know of any companies that referbish wave solder pallets. Ours are a little worse for wear, I know of BLT re impregnating the pallets, but can say that the pallet we tested the process on didn't look promising.
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Mon Sep 17 14:57:11 EDT 2001 | ert002
We are printing 0.012" apertures on a .012" Solder mask defined pad in a fine pitch BGA application. The board is 0.032" thick with very little room on the bottom to place support pins under these areas. Our first pilot proved extremely difficult to
Electronics Forum | Fri Sep 08 16:09:42 EDT 2000 | Erv
We do one of two things here; 1. We have cut up a bar of solder to different lengths, wieghts, etc. and place them on top of the offendinding floater, or 2. On selective wave pallets we will build a jig/clamp to hold down the part.
Electronics Forum | Thu Aug 24 15:35:55 EDT 2000 | jkervin
Hi Dr. Lee, Besides the requirement of a PB free surface finish on PCBs, could you tell me what the pros and cons of a Bismuth bearing solder are? Thanks, Jon Kervin
