Electronics Forum: solder a (Page 571 of 1484)

ZEVAC drs 22

Electronics Forum | Wed Nov 01 12:52:47 EST 2006 | ch

What are the main advantages of having a Zevac DRS 22. I just completed a through hole and SMT soldering course and I am thinking of investing in the DRS 22. What are the chances of getting a return on a $10,00 to $15,000 investment doing rework an

IEC - 60601 compliant LF-NC Wire Solder

Electronics Forum | Mon Jun 04 18:23:41 EDT 2007 | greggc09

Patrick Q1) Is the test pattern similar to the IPC-B-25? A1) - No - Tests were run on a prototype assembly. Q2) what is the temperature in the test chamber and voltage supplied to the test coupons? A2) 25C with 3.3VDC. Q3) Does this test i

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW

| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost

Solder Spheres, JEDEC Package Tolerances

Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet

In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit

Solder balls on Ceramic

Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22

3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as

FR4 vs Ceramic mismatch

Electronics Forum | Tue May 05 17:01:25 EDT 1998 | bob

I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventuall

forming axial-lead for elavated horizontal soldering to SMT pad

Electronics Forum | Wed May 26 05:05:04 EDT 2004 | curious

hi, we have a batch-rework for a axial 2-lead LED component. we are thinking of bending both ends of the axial-leads into a L-shape at 90degree angle, and solder the flat-end of the L-shape flatly to the PCB's SMT pad. hope the experienced guys/exp

Tip life of soldering irons with lead-free (SAC305)

Electronics Forum | Mon May 15 04:33:35 EDT 2006 | Rob

Hi Steve, Although your opinion is valid, calling something from a respected Japanese manufacturer crap is a little harsh. I have seen many people solder very well with all sorts of leadfree alloys - not producing crap. I've already had a play wit

Solderbridges wave soldering

Electronics Forum | Mon Dec 04 21:42:12 EST 2006 | KEN

Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in your evaluation. I have an assembly that we run 10k pieces per month. One two-pin connector has a pitch of 1.27mm. Unfortunately, the pads are 0.007"

Re: Wavesolder Bridging

Electronics Forum | Mon Dec 28 19:28:57 EST 1998 | Chad Haima

| We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I realize


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