Electronics Forum | Fri Jan 25 11:49:09 EST 2008 | toddl
Hi all, I have an inconsistent situation. Lately, we seem to have excessive dross buildup in the solder pot which inturn causes the pot to overflow. Has anyone had a similar experience? Here are the details: age of machine= 9 years, flux used= Kester
Electronics Forum | Thu Sep 30 15:46:22 EDT 2010 | vetteboy86
Hi Folks, I'm looking for detailed information about the different composition of circuit board pads. We have been experiencing some issues with our solder, and I would like to know the differences between compositions. I do know that we ran a cust
Electronics Forum | Fri Feb 15 06:59:07 EST 2013 | davef
Use a standard that everyone will recognize. If you say, "The solderability test was performed in accordance with ANSI/J-STD-002 'Solderabiility Tests for Component Leads, Terminations, Lugs, Terminals and Wires'” [ipc.org/TOC/J-STD-002C.pdf ], every
Electronics Forum | Wed Aug 22 08:28:04 EDT 2018 | hussman
Hi rob, I did request info from Kingston but their on-line help is basically no help. they bounce your around from one group to another. we have reflowed the part at high temp settings and it does seem to work. I was just wondering if I could g
Electronics Forum | Fri Jun 07 04:57:53 EDT 2019 | gregoryyork
Its more than likely the conveyor is slightly out and needs dropping. You do have a fairly significant contact though so are you sure the Solder pot isnt running too cool for Lead free, needs to be around 275C for good wicking and flow or 250C if lea
Electronics Forum | Thu Jan 27 20:17:25 EST 2022 | stephendo
What exactly counts as "always on"? Our ROHS wave solder machine is always on during the week but the pot shuts off at the end of the shift and turns on early in the morning so that the solder is melted before we get to work. It is only using a small
Electronics Forum | Mon Dec 13 00:48:33 EST 1999 | armin
Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? What�s the term unsupported and supported holes refer to in IPC-2221 9.1.2 Annular Ring Requirements? I have a proto-type PCB (designed by our R&
Electronics Forum | Fri Oct 01 16:17:10 EDT 1999 | Dave F
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
Electronics Forum | Thu Apr 28 08:29:22 EDT 2005 | andymackie
If what you are talking about is "assembly materials", then consider the following: - Solder paste - Wavesoldering fluxes - Bar (for filling wavesolder pots) - Underfill (for TCE-mismatched CSP's and flip-chip) - Cleaning fluids (for post-reflow boa
