Electronics Forum: solder a (Page 816 of 1484)

Evaluating SMD Adhesives

Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef

It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard

Info on OSP PCB�s

Electronics Forum | Fri Jun 01 12:23:22 EDT 2001 | medernach

I've had good and bad experiences with OSP's. First of all, ask yourself, "Why use an OSP?" If you don't need it, don't use it. Solderability is dependent upon the number of thermal passes (the fewer, the better), the thickness of the coating, the

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: MI Solder temp & RF routing

Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon

| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony

| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony

| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T

| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |

Cracked ceramic chip capacitors.

Electronics Forum | Thu Apr 10 20:57:03 EDT 2003 | Ray Chartrand

I've also seen "as received" defective devices. A tier 1 EMS I was working with put down an entire shift worth of these devices before it was noticed. Their rework costs were $$$. Just goes to prove that there's no free ticket and when bean counters

speedline sale

Electronics Forum | Tue Nov 11 18:28:18 EST 2003 | Kevin

It sounds to me like Electrovert is a thing of the past. They were bought by a financial clearing house company and were sold because they have been losing money consistently. The new Speedline owners have moved all of their operations to the East

Ionic Cleanliness testing

Electronics Forum | Tue Apr 03 17:13:33 EDT 2007 | kmorris

Just wanted to do a poll to see how others are determining their test time for Ionic testing. Test Method IPC-TM-650 number 2.3.25, section 5.3.3, says "The test time should be in accordance with the monitoring plan criteria (set time or auto-shutof


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