Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Mon Dec 16 15:12:05 EST 2002 | sueph
I made a small bean bag from 100% cotton filled with rice, to hold down small resistors that wanted to tilt over solder wave. It worked fairly well as long as I didn't try to take it off the components to soon, as sometimes they would want to stick
Electronics Forum | Thu Aug 28 20:24:30 EDT 2003 | yukim
Hi, do you know how much the problem can be reduced by using anti-tombstoning solder paste? I tried two different lots using same solder paste (containing Ag). With one we did not see any improvement and with the other one, a lot. So, I am not quite
Electronics Forum | Tue Jun 17 01:45:30 EDT 2003 | Dreamsniper
Hi, All these guys have provided you good solid infos already! All I can say is that check your wave solder machine's mechanical set-up too...and the Molten Solder Level in the bath must be maintained at an accurate level/height specially after ded
Electronics Forum | Sun Sep 12 21:31:49 EDT 2004 | Jim
MAke a new stencile and have the aperatures reduced by 20% in X and Y. This has solved 90% of all solder balling issues I have ever dealt with. Be careful with your fine pitch and micro-BGA's. If you are not having problems with fine pitch and 1:1
Electronics Forum | Sun Dec 19 09:59:53 EST 2004 | Scott S
BEST, Inc. has joined SMT in providing their forum on the solder.net website. In an on-going effort to inform and educate it's customers and prospects, BEST has signed up with SMTnet to offer this forum on their already popular website. If you have
Electronics Forum | Mon Feb 28 16:21:41 EST 2005 | lyrtech
Thanks a lot to all of you! I found my problem: It was the pressure of the ultrsonic spray fluxer who was to low. The flux didn't wet all the hole and the solder didn't fill completly the hole. No one in my area knew the solution. Thanks one more ti
Electronics Forum | Tue Mar 15 10:44:42 EST 2005 | jdengler
-If the aperture volume is the same, there will be more solder on the HASL finish joint due to the solder already present on the pad. This difference is not usually enough to cause insufficiant solder volume but will "look different". Sometimes an
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Sun Jun 12 19:22:52 EDT 2005 | techknow..
When examining a Bga using an Ersascope, I found that all the joints where good. However I found that the first few solder balls from left to right ( vice versa ) seem higher than the middle solder balls. It appears that the body of the part is flex
