Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Wed Dec 10 09:29:59 EST 2008 | rgduval
Oops...just noticed you were referring to wave soldering. We'd still suggest a water-soluble flux, instead of the no-clean; especially at wave soldering. Also, checking pre-heat temps, and dwell time on the pot. Is the wave a chipper wave? If not
Electronics Forum | Fri Aug 23 13:06:42 EDT 2024 | carl_p
Hello, Currently having some solderability issues with some thru hole soldering of various components. Fuse Holders, LED's, Connectors etc etc... Normally no issues at all. So far i've tried baking the boards, calibration of soldering irons etc b
Electronics Forum | Thu Jul 03 17:22:03 EDT 2008 | mikesewell
On an ACE KISS machine we could program a drop in Z height to give a peel off angle after the component was soldered. Usually not necessary as the solder at the nozzle is falling away from the lead down the nozzle. If possible, we would program a fr
Electronics Forum | Tue Jan 27 10:52:22 EST 2015 | dyoungquist
Taking a shot in the dark...... Are you using the correct oven profile for the connector? Solder tends to flow (wick) towards the hottest part of the connection/pin/pad it is on. It may be that the hottest part is the connector itself where the pi
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory
Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i
Electronics Forum | Mon Aug 13 11:05:18 EDT 2007 | saaitk
Would I be correct in assuming that the solder used to attach the BGA ball to the device body should have a higher liquidous point that the solder used to attach the device to the board. If the peak reflow temp for SnPb is around 225 deg should the b
Electronics Forum | Fri Aug 24 01:25:58 EDT 2018 | cupet
Hi everybody, please advise in case of soldering problems after the reflow soldering. The problem occurs randomly at different locations on different PCB's (not the complete surface of the board). These places are very difficult for rework. Could you
Electronics Forum | Tue Jun 27 11:16:33 EDT 2000 | Christopher Lampron
Hello Bill, Ioan's idea's are good. One more thing that you may want to consider is using a "Home Plate" aperture on your stencil for the aforementioned caps. The idea is to put a smaller amount of solder paste directly underneath the component. This
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