Electronics Forum | Tue Dec 17 09:48:44 EST 2002 | russ
Temps are related to the components/PCBs being soldered. I am not aware of any Industry standard. If you are soldering flex circuits, .020" boards etc.. We use 500 deg tips a little thicker PCB/lead we go to 600, and so on. We never exceed 800 in a
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Thu Oct 14 06:27:45 EDT 2004 | davef
a disturbed solder joint. * Extended/slow cool down ramps can result in surface texture => grainy solder joint. Second, the "BGA scaling" could be a reflection of: * Too little heat (incomplete solidification) OR * Too much heat (excess grain growt
Electronics Forum | Sun Feb 26 13:49:18 EST 2006 | masrimhd
Hi, We will run a no-clean wave solder process to assemble TV boards. What about incorporating a ROSE Test equipment (Ionograph, zero-ion, Omega Meter) in the process? Is it recommended, helpful or unnecessary? I�ve read about the use and limits of
Electronics Forum | Sun Mar 19 12:11:09 EST 2006 | Cal Kolokoy
Larry, 180 Deg. C (?) to start the profile seems a tad on the high side for a 7-zone oven. You risk too high of a ramp rate and solder beading. At 7 zones, there's no reason to get too hot that fast.
Electronics Forum | Fri Nov 08 11:37:44 EST 2002 | jonfox
1. Back in the early days of consumer digital cell phones, we ran into the same problem. PCB with 2000 parts in a 5"x2" area, and double sided. We ended up using our standard vacuum tooling for the NIC side and stiff ESD safe foam for the NAC side
Electronics Forum | Thu Aug 23 08:31:09 EDT 2007 | ck_the_flip
Dave, that's good thread, but I think Mike is more concerned with the Titanium inserts that pallet manufacturers often use to overcome sh*tty designs - like the ones where they put a Through-hole 2mm away from a SMT pad. He's not so concerned about t
Electronics Forum | Tue Sep 06 12:39:06 EDT 2011 | deanm
According to IPC-7351A, the optimum fiducial is a solid circle with a minimum of 1mm diameter, but can be up to 3mm. There should be a solder mask clearance a minimum of 2x the radius of the copper circle. So the minimum fiducial size is 0.040" with
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Fri Jan 03 11:42:38 EST 2003 | soupatech
Hi, I am loading a new board with mostly 0603 packages. The pads are .5 mm apart and I am having a big problem with parts shifting towards eachother instead of centering on the pads. I believe this is caused by too much solder. I am using a 7mil sten
