Electronics Forum | Fri Apr 21 18:43:23 EDT 2006 | SD
Sorry, I have not read the article. However, I do have five years experience constantly tweaking an AOI system that ran ONE product! The strength of the machine was solder inspection. The biggest problem was component color variation and shadowing
Electronics Forum | Mon Oct 11 11:13:32 EDT 1999 | Wirat S.
| | | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almo
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Wed Mar 24 15:48:33 EST 2004 | davef
KIC Thermal Profiling did a DOE [Nepcon West 1999] [you probably can find it posted on their site] on thermocouple attach. Comparing the reliability and repeatability of thermocouple attachment methods: * High temperature solder was found to be the
Electronics Forum | Fri Jul 07 16:04:42 EDT 2000 | DONALD
We have an Ersa selective soldering machine here. We use the wire solder with the automatic feed. We dross and clean the pot roughly once a week. You can tell when it needs it by looking at the solder fountain. We do the nozzle at the same time. We c
Electronics Forum | Tue Apr 29 15:45:09 EDT 2003 | davef
We have mixed bar solder from alternate suppliers in our wave soldering machine. Issues that you need to address before changing your solder supplier are: * Assure that the alloys are the same. In this, consider imaginative people may be reporting
Electronics Forum | Fri Jul 09 10:32:47 EDT 2010 | rafacadiz
Hi Sean, I have seen this issue with lead free component on Sn-Pb solder process, I don´t know if it´s your case. Some times, pins not reach the necessary T for solder due to lead free metalization and in other case due to a groud pad, with a big T d
Electronics Forum | Tue May 22 11:08:12 EDT 2012 | patrickbruneel
It sound like this connector is a serious head sink which can be solved with more preheat or slower conveyer speed. It might also be a combination of the heat sinking capability of the connector together with encapsulated flux underneath the connecto
Electronics Forum | Wed Jul 06 15:29:01 EDT 2022 | glasscake
Also I should mention, I've ditched the formulas for getting the "optimal" solder amount after being bit by them once. Now I just design a PCB with 4-10 spots for the connector then order a stencil with a range of aperture sizes. Figure out what give
Electronics Forum | Wed Oct 06 22:55:14 EDT 2004 | davef
Your customer is correct. Components should not fall a board during a reasonable drop test. A shear test poorly represents a drop test. A drop test represents a drop test very well. If you want to proceed with shear testing, search the fine SMTne
