Electronics Forum: solder and ball (Page 91 of 311)

Water cleaning and Moisture Entrapment

Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs

I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 09:09:56 EDT 2012 | davef

Sure you can use it it with leaded HASL. Recognize that ... * Your Sn42/Bi58 will no linger be Sn42/Bi58 * Your leaded HASL will no longer be the same leaded HASL that walked in the door to your plant * Lead from HASL coatings can diffuse through the

voids- leaded and chip components

Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel

Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)

Pick and Place Operation-Support Costs

Electronics Forum | Fri Jun 04 17:15:22 EDT 2004 | drlou

I also need help with the following Questions: 1. What is estimated yearly external service/support costs? 2. What kind of internal expertise do we need for in-house operation and maintenance? 3. How many operators are typically needed for one pnp m

RTS (Ramp-to-Spike) and RSS (Ramp-soak-spike)

Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam

we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1

Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai

Leaded and Lead-Free Wave Parameters

Electronics Forum | Wed May 21 15:52:24 EDT 2008 | samir

Wow RealChunks! What happened to that firey b#tchey Asian temper of yours? :-) Speak your mind and forever hold your peace! Here's what I know about Lead-Free Wave Soldering: 1.) Hotter pot 2.) Longer dwells Good info. on fluxes, by the way.

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 14:07:29 EDT 2008 | jdumont

We use a normal off the shelf (Best Buy) mini fridge. As far as the temp readings, I got some USB dataloggers from Omega and stick them in there. Download the data to your PC every couple of weeks (Outlook reminder). I also use these for our Nitrogen

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 14:26:20 EDT 2008 | davem

80 degrees F in the Summer. Also, "It is not recommended to store foods which must be kept at below 40� F for safe storage". Obviously we're not storing food, but the point is still valid. jdumont, Thanks for the data. I have a couple of Extech di

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip

As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit


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