Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo
I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er
The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l
Electronics Forum | Sun Jan 13 19:44:02 EST 2008 | grantp
Hi, We need to solder a USB plug onto a PCB in our SMT machines, and this is the same type of plug you see on USB storage devices. It's a very flat connector with 4 SMT pins, however the hard part is the bottom of the connectors is the same level
Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef
First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F
From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Thu Jul 20 14:57:26 EDT 2000 | Bob Willis
I have just measured my new test board and the dimensions are 0.025� square, 0.015� seperation with resist aperture 0.004� larger. Don�t know when I will be using it yet. I have not seen a head to head with these pastes yet, I know that Panasonic ar
Electronics Forum | Wed Oct 20 10:41:22 EDT 1999 | Eric Lerz
Our company (assembler and user) has experienced some board problems relating to warpage and solderability. The manner in which they are packaged by our fabricators and stored in our stock prior to assembly has been questioned (as one of many factor
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