Electronics Forum | Tue Feb 06 13:16:09 EST 2007 | jaimebc
Leaded paste, is what we use if the process or product requires it.
Electronics Forum | Tue Feb 16 13:30:20 EST 2010 | asksmt
Hi, I have specified Lead Free Plating for my Four Layer PCB. but the Final Production Solder Process is not Lead free it is leaded Process. My question is will there be an issue if we use Lead free plating on PCB and use leaded solder material fo
Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F
1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan
Electronics Forum | Fri Oct 22 06:19:42 EDT 1999 | TNT
Ron, if I am reading this correctly the 20mil parts are not having problems on a 6mil stencil. If you increase the entire thickness of the stencil to 8mils, there should not be any issues with the 20mil components. The supports you are using could p
Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1
We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Wed Mar 07 15:45:12 EST 2007 | dphilbrick
I have an Amistar Label Placer. Although it is a bit more expensive than a feeder it won't take up placement time on your real expensive P&P equipment you can put in line or off line. with added printers it will print and place different labels on th
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
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