Electronics Forum | Wed Apr 25 10:45:25 EDT 2007 | slthomas
I read the request months ago with great interest. However, a request is hardly an exemption. Here's my issue with the language: "23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead fra
Electronics Forum | Wed May 14 12:42:16 EDT 2008 | rgduval
Dave, Realized I didn't respond to one of your questions. We pasted and reflowed one board, with no components. This board exhibited extreme dewetting on all pads. The board was LF-HASL, and the paste was Qualitek (which we've used for approximat
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
Electronics Forum | Thu Jan 13 22:05:46 EST 2022 | mihai_voivod
-Thank you Thomas. In the past I have tried using a clip to hold it in place and it partially worked as a significant amount of connectors ended up shifted causing defects and necessitating rework. -I am going
Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon
| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'
Electronics Forum | Wed Jun 30 08:58:59 EDT 1999 | M Cox
| | | | snip | | | | | John and Dave, | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like p
Electronics Forum | Wed Mar 14 09:07:34 EST 2001 | blnorman
We just ran a study to try to determine this. We exposed the paste to 85% humidity to simulate worst case manufacturing. At various times we removed the paste from the chamber and tested it for tack, solder balling, wetting (copper coupon), and vis
Electronics Forum | Thu Apr 02 11:12:34 EST 1998 | Justin Medernach
| Looking for Cleaning solvent to claen missprinted PCB, that will be good for paste (CS) and glue (PS). | One that is easy to evaporate with out leaving | white powder around component leads on CS (when cleaning PS) Ron, If you are running a no-cle
Electronics Forum | Mon Nov 25 07:58:27 EST 2002 | Yannick
Hi, I made a board wich I plated with immersion Tin, I tought it should be the same result as we had with tin lead but we ran into a weird problem. WE use a 63/37 no clean paste and on the Board with Immersion Tin the solder just make a ball ON
Electronics Forum | Fri Aug 15 09:48:10 EDT 2003 | davef
First, what do you mean by "mishandled OSP" boards? Second, we don't like to bake our OSP boards, because of the potential to degrade the coating. Why do you want to bake these boards? Third, why not paste-up a board, reflow it, and assess the sol
