Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Fri Apr 01 11:04:35 EST 2005 | chunks
A company called BEST makes a thing called Stencil Quik. It's like a stencil that sticks onto your board, you squeegee paste, place component/board and reflow. The Stencil Quik remains on the board. It prevents shorts and in your case could provid
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Jan 09 12:01:53 EST 2003 | Hussman
It depends on what the finished solder joint looks like after reflow. Use IPC to determine your solder joint acceptablity and check for solder shorts/solder misses to determine how far our of alignment you can go. Hope your not working with theta o
Electronics Forum | Tue Sep 12 01:50:22 EDT 2006 | meritajs
Hi All, We find out that some companents in leed free reflow soldering process have bad wetting and soldering This soldering problems caused by companent storage time after shipment Could somebody inform us about maximum storage time for different c
Electronics Forum | Mon Oct 20 21:57:58 EDT 2008 | jdt13
The problem that I see is the pads not soldered and I can see on the X-Ray the solder on the pad after reflow, and yes the solder has melted in a uniform fashion, I have not measured the diference of temperatures in each pad of the PCB, the size is a
Electronics Forum | Wed Jul 29 04:03:15 EDT 1998 | Bob Willis
The Reflow Soldering Interactive Test was well received in the industry with over 200 engineers testing their process knowledge. Now its time to take the Wave Soldering challenge and test you knowledge on soldering through hole and surface mount. Bot
Electronics Forum | Mon Oct 21 09:22:56 EDT 2013 | sara_pcb
One of our PCB for high reliability application is having 2 BGAs(11X11, ADV 204), The pitch is 1 mm. We decided to wire the BGAs first using re-flow soldering and the rest of the components by hand soldering. Since the PCBs are for high reliability a
Electronics Forum | Mon Oct 14 17:23:36 EDT 2013 | markhoch
Thanks 'hege for the info. Have you seen a reduction in solder defects after switching from Air Reflow to N2 Reflow? I'm curious, because in my experience of over 20 years, working at five different companies, (Jabil being one of them), I've never u
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