Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Thu Aug 28 23:15:44 EDT 2014 | phyllishwl
Hi all, Our production reported that they found 3 panels out of 53 panels with strange phenomenon after reflow. 1/ Blister / Delamination of PCB panels, 2pcs blister/delamination under solder mask, 1pc under Gold plating at Gold finger 2/ Silkscr
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Mon Sep 14 18:09:16 EDT 1998 | Dave F
| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste
Electronics Forum | Thu Dec 22 12:05:37 EST 2005 | Tony
Currently we are using a 2 step vapor soldering process to manufacture our std. lead soldered parts. The first step was done with a ls240 vapor fluid and the second was done with a ls200 fluid. Using a 221 deg C sn95/Ag5 solder for the first step a
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.
| | | A question for you all! | | | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we coul
