Electronics Forum | Wed Dec 26 11:01:31 EST 2007 | swag
Thanks, rywman. I do have a solder sample along with dummy BGA's so we should have what we need. This BGA is actually 1152 pins (I didn't have that right in my original post). The bad part is that we are building only one board only and the actua
Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef
You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the
Electronics Forum | Fri Aug 08 13:21:14 EDT 2008 | RobP
With AOI it really depends on what you are testing. Not only what criteria, but what different types of components. We run a high volume low mix application for automotive checking for presense, positional accuracy, and all solder joints. We curre
Electronics Forum | Tue Sep 16 09:35:12 EDT 2008 | babe7362000
Can anyone tell me if there is a procedure for storing raw PCB's? We currently are seeing an issue with lead free boards with dewetting. We tracked it down to one or two datecodes, but not all of the boards have dewetting. Is there a expiration da
Electronics Forum | Thu Oct 23 12:31:56 EDT 2008 | jdumont
We use Cooksons prepaid "Pot-Rite" program which sends you as many preaddressed envelopes and order sheets as you order. When it comes time to send out a sample you just pop it in the envelope and mail it out. They also have all the molds and ladles
Electronics Forum | Sat Jan 03 17:43:31 EST 2009 | proy
Hi Wondering if anyone here is/are filemaker Pro users? I am writing a simple data collection program in Filemaker for pre-solder, pre-test inspection to replace paper sheets. Together with wireless touchscreen tablets I think this is going to be
Electronics Forum | Tue Jan 20 07:57:00 EST 2009 | mrdtech
Depends on the solder paste. If it has been on the stencil for 24h there is a good chance that the paste is destroyed. You can however check if it has not dried out too much by letting the stencil printer do a few strokes and see if the paste still h
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Mon Mar 30 20:22:31 EDT 2009 | 89jeong
Thanks for your answer. For your question, this problem first happend on board with components so,we tested a board without components. As you said(only your case),if i inform our supplier, i will not get any answer from him and this will be very
Electronics Forum | Wed Feb 04 03:30:56 EST 2009 | smartasp
Hi All We intend to switch fro SAC305 to SN100C, which has been giving us great test results. Unfortunately we have a technical guy at head quarter, which refuses to accept the SN100C as it has a 10 deg C higher melting point as SAC. I argue besides
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