Electronics Forum: solder ball test (Page 76 of 418)

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Functional Test Failure due to BGA ICs

Electronics Forum | Tue Jul 25 08:34:30 EDT 2006 | GS

Does your board passes also through the wave solder step ? If, yes, it could be a matter of secondary reflow on BGA ball solder joints. Best Regards....GS

Tented Via's

Electronics Forum | Thu Feb 21 17:19:08 EST 2008 | davemn

if you are not using them for test points or want them filled with solder for current carrying capability then tent them puppies. i was able to move our company away from exposed vias many years ago and this eliminated lots of hairline shorts between

Re: all powerfull UP78..or is it..? - Homeplates..??

Electronics Forum | Sat May 08 07:41:00 EDT 1999 | wayne sanita

hello, i have been using up-78 ultraprint for over a year now. at first we were getting lots of solder balls mainly on 0805's. this happened with all paste we used, too much solder under component leads. i have been using apertures reduced 10% homepl

Sheer strength of a BGA assembly

Electronics Forum | Thu May 06 11:37:48 EDT 2010 | davef

There is no specification. Shear tests are very material / operator dependent. BALL SHEAR TESTING OF RAW BGA DEVICES: A total of 3 devices were subjected to ball shear testing. Results of the testing indicated shear values in the range of 0.7-1.25

Solder Balls @ the Wave Solder Process

Electronics Forum | Tue Nov 27 14:24:13 EST 2001 | mparker

Short term fixes can be: have the vias "plugged" with solder by the fab house. This works if your fab is HASL finish. Tent the vias with solder mask, top side only. You may get a flux entrapment issue in the vias with this manner. Long term fix can

BGA Vs. QFP

Electronics Forum | Wed Jul 12 13:56:49 EDT 2006 | muse95

From a design/test/troubleshooting perspective, I would pick a QFP hands down - I can't probe a hidden solder ball.

Solder balls defects

Electronics Forum | Tue Aug 14 08:09:32 EDT 2018 | buckcho

Try something drastic just for testing - turn off cleaning! Then check again the result. Trust me, you can be surprised.

Re: Process Trial Records

Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F

| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th

Re: all powerfull UP78..or is it..? - Homeplates..??

Electronics Forum | Sun May 02 19:09:46 EDT 1999 | JohnW

| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |


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