Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
Electronics Forum | Wed Nov 29 08:33:05 EST 2000 | Dave F
No, the specific question is on the "Soldering & Rework" disk. Yours is a good approach to updates. [No lakeside baronal mansion, eh???] I have sent a list of unusual questions to Evelyn that includes the above example. It's difficult to document
Electronics Forum | Tue Sep 19 09:34:33 EDT 2000 | Erick Russell
There are two places where Laser Soldering is used for rework. One is the low volume, high mix environment where the board value is high. The other is the high volume (regardless of mix) facility where fast process time and quick set-up is required.
Electronics Forum | Mon May 07 09:44:56 EDT 2001 | wister
Normally,titration kit is used for low solid flux,provides a more accurate method to determine the flux concentration so as to assure consistent soldering results.There are three chmicals in the process.test kit solution,indicator and your flux.add d
Electronics Forum | Fri Jul 13 01:34:13 EDT 2001 | dlkearns1
Quick update on my issue of " wicking ". I had some talk with the company QA guy. Told him I saw no wicking on the test panels at 30X. The next day he came up to me and said, he kinda saw a little something at 60X then verified that at 100X, So, he
Electronics Forum | Thu Jul 26 13:49:48 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Thu Jul 26 14:06:46 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
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