Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Wed Jun 05 13:21:11 EDT 2002 | Hussman69
That's OK, as long as you didn't say breading, I knew what you meant. Well, for a quick fix try placing Kapton tape over the gold. It's not a cure, but gets you product. Next try putting a couple of non-screen printed boards thru the oven and se
Electronics Forum | Tue Apr 02 07:12:38 EDT 2019 | jchris
I worked with a PACE TF1800 for about a month on a project last year and it performed flawlessly for BGA and QFN installations and removals. It can handle boards up to 12"x12". Really easy to use with excellent profiling software that walks you throu
Electronics Forum | Wed Nov 01 07:41:39 EST 2006 | billyd
I'm reworking lead free BGAs now, on a Conceptronics Freedom 3000. I use flux only (no-clean, Indium) all the time, with no issues. If you go to paste, you also understand that you still have to hit the same temperatures as with flux, as the solder i
Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T
| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Sat Jan 05 10:21:29 EST 2002 | Todd Murphy
Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyo
