Electronics Forum | Thu Mar 24 16:53:53 EDT 2011 | davef
Can you jumper the via to the pad?
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika
Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-
Electronics Forum | Fri Mar 04 00:46:36 EST 2011 | kemasta
Hi ScottE "Is this ball sitting on a via?" I am not sure is I answered your question correct, the ball is sit on the pad.
Electronics Forum | Wed Mar 23 22:29:21 EDT 2011 | nkinar
I have a few prototype circuit boards with BGA footprints where some (but not all) of the vias have been placed too close to the pads. During reflow, some of the solder from the balls flowed into the holes. Only one of the pads under the BGA is not
Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef
Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
