Electronics Forum | Sun Jun 12 08:37:20 EDT 2005 | davef
Paramjeet Singh Gill Flip chip with aqueous flux, that's interesting. * What is the stand-off from the board is your flip chip? * What machinery and materials do you use clean your boards? * How do determine the cleanliness of the board under the fl
Electronics Forum | Mon Dec 17 11:20:12 EST 2001 | slthomas
Well, I was able to convince them we had a serious problem on the poorly reflowed boards without spending 2k on off- site analysis. Now all we have to do is sort out the ones that flowed well but had solder balls (looks like a damaged stencil prob
Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna
We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the
Electronics Forum | Thu Oct 23 04:19:15 EDT 2014 | garteaga
Our reflow oven builds solder on one specific panel type. It will have solder buildup inside the oven. We then end up with small solder balls on our panels. We think it may be the solder paste, the screen printer is leaving a clean wipe under the pa
Electronics Forum | Tue Oct 31 22:13:48 EST 2006 | davef
We never run raw solder paste through our board cleaner, because: * Flux floats on the water in the tank and contaminates everything, including the boards being 'cleaned'. [Prove this to yourself by observing the location of gray schmutz on the insid
Electronics Forum | Fri Mar 23 15:33:53 EDT 2007 | ppcbs
Does anyone know where to purchase 90/10 & Lead Free solder balls and kits for BGA Reballing? I'm having service problems with my current vendor who decided that they no longer wish to sell 90/10 balls, can't take in an order without a quote, and ca
Electronics Forum | Sat Jul 25 08:47:25 EDT 2009 | davef
Both "moisture content of bare board" and the "thickness of the copper plating in the PTH" are related to each other. As you heat the solder connection, moisture in the board boils and out-gasses through the solder connection. Plating with the proper
Electronics Forum | Mon Apr 12 09:09:25 EDT 2004 | russ
If they are reflowing pbfree balls to bare PCB pads they are getting that component very hot tpo melt the balls and get them to wet to the pads! I would not recommend this process at all for hightemp solder balls, for 63/37 this process is fine. As
Electronics Forum | Mon Aug 12 12:58:16 EDT 2002 | pjc
What I've done w/ eutectic ball BGA devices is after removing the BGA from the PCB, solder-suck the lands- get em nice a flat, apply a thin coat of gel flux to the solder lands and then a thin coat to only the bottom of the solder balls on the new BG
Electronics Forum | Mon Jan 14 06:28:18 EST 2008 | gregoryyork
Hi its normally down to the state of cure of the resist type not the actual type be it matt or gloss. If its not cured correctly it will produce solder balls. Pending where you are you could try our 35-41 or new 35-41-30 flux this will reduce the pro
