Electronics Forum | Tue Oct 26 16:55:12 EDT 2004 | davef
More background please: * What is the condition of failure [eg, part damaged, part poorly attached, etc] * You mention heel and side fillets. What about under the component? * Are the components properly attached? Or are they floating on a bed of fl
Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Wed Mar 22 21:27:45 EST 2006 | KEN
Find out the lead frame alloy. Cte mismatch can cause the same defect. Ran into this 3 years ago wave soldering with Tin-Copper.....okay, you caught me. I admit it. Wavemaster larry told me about this and I'm posting it under my name. Shameful, I
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
Electronics Forum | Wed Jul 06 09:27:49 EDT 2011 | rdouglass
Has anyone come across any good visuals for the solderability requirements for component leads with toe-down configuration? IPC-A-610 does not have any visual aids for this category and our inspectors are having a difficult time assessing based sole
Electronics Forum | Thu Jan 05 11:23:49 EST 2006 | samir
Grant I'm gonna have to go ahead and sort of disagree with you there. The studies that I've been reading from various BGA Manufacturers have identified insufficient homogenizing / coalescing of the Sn/Pb Paste with the SnAgCu balls. Ball not touchi
Electronics Forum | Fri Jun 04 10:02:06 EDT 1999 | Chrys Shea
| | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole
Electronics Forum | Fri Jun 04 17:10:59 EDT 1999 | C.K.
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Tue Jun 08 11:40:03 EDT 1999 | Steve Skinner
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Tue Jan 13 20:52:21 EST 2004 | davef
Bismuth Solder alloys * Fatigue life is reduced when soldered to hot air solder leveled (HASL) boards. * Lead from Hot Air Leveling (HAL) coatings can diffuse through the grain boundaries of alloy. * Lead is bismuth alloys can form a eutectic composi
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