Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Thu Aug 11 08:56:20 EDT 2005 | pjc
Some causes of lack of top side fillets (hole fill) are: 1. Not enough pre-heat (a top side preheat will help, if no-clean flux, be sure to follow flux mfrs specification for top side board temp just before hitting wave) 2. Not enough flux 3. Flux i
Electronics Forum | Tue Jun 13 16:45:30 EDT 2006 | adlsmt
If the only difference is the layer count, check the profile as stated above. If you dont have a profiler you can probably get the local Kic or Mole rep to do a demo on that board. I believe I was the one who stated in an old post that prying the lea
Electronics Forum | Wed Oct 11 09:27:08 EDT 2006 | Rob
Yes, the main horror story is the cost. Also you will have to dispense/print in lower quantities and with different patterns than solder paste. It does not wick up device legs, it will not correct a part during reflow (no floating action)and will o
Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ
Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in
Electronics Forum | Wed Jan 30 02:50:33 EST 2019 | electronics101
Hi Steve Thanks for coming back to me, you are correct IPC class 3 is required. We are getting great wetting onto the device but not as per IPC 3 with the wetting rising about 0.25mm. I am questioning whether it is actually possible with such a (re
Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef
From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n
Electronics Forum | Mon Jun 28 22:02:13 EDT 1999 | Dave F
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Tue Dec 13 07:01:56 EST 2005 | clampron
Good Morning, We are currently using 4 Mirtec machines. We decided on the Mirtec after a side by side evaluation of several tabletop machines. I have to admit that Yestech was not one of them. However, after the evaluation, the Mirtec outperformed t
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
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