Electronics Forum | Wed Nov 08 10:48:34 EST 2023 | processman
Hi Was wondering what the general take is with reflow profiles to take into account differing solder paste alloy compared to the solder alloy used for the bumps of a bga device. For instance, SAC305 solder paste and BGA device with SAC105 (higher m
Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan
Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation
Electronics Forum | Thu Jul 15 10:28:49 EDT 1999 | Boca
| I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspecti
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Tue Sep 25 14:38:05 EDT 2001 | nwyatt
1. SRT has been recently calibrated - problem is too many hands in the machine and careless mistakes. The profile is good and has been recently checked by a fellow from Genrad. 2. We are relying on the left over solder from the previous joint and
Electronics Forum | Tue Mar 15 07:59:07 EST 2005 | mattkehoe
We are looking for some feedback on this situation. Please let us know if you have any ideas. Thanks in advance. I have been doing some studies on defects and such with our PCB's in prep for lead free and I've come to a conclusion about our process.
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Thu Apr 26 09:05:16 EDT 2007 | realchunks
Hi D0m0 Can you standardize on your temps and just adjust conveyor speeds for various sizes of the boards? Another trick is to parallel t-couple plug off the actual t-couples of the oven and mount the plug in an easy access point of the oven. The
Electronics Forum | Wed Sep 05 10:59:02 EDT 2007 | slthomas
What's sad is, it really happened. I won't bore you with the details again. ;) Lloyd, I would love to have a nice Hi Scope too (I think Cchunks works for one of those big champagne and caviar corporate entities ;)) but if you can't swing it, at leas
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
